unsourced date February 2008 Dark Current Spectroscopy is a technique that is used to determine contaminants in silicon . science stub Category Silicon Category Semiconductor device fabrication Long comment to avoid being listed on short pages ... more details
Orphan date February 2009 Multilayer soft lithography MSL is a fabrication process in which microscopic chambers, channels, valves and vias are molded within bonded layers of elastomer . tech stub Category Lithography microfabrication ... more details
Orphan date February 2009 Selective area epitaxy is the local growth of epitaxy epitaxial layer through a patterned dielectric mask typically Silicon dioxide SiO2 or Si3O4 deposited on a semiconductor substrate. Category Semiconductor device fabrication Chem stub ... more details
Unreferenced stub auto yes date December 2009 Phosphosilicate glass , commonly referred to by the acronym PSG , is a silicate glass commonly used in Fabrication semiconductor semiconductor device fabrication for intermetal layers, i.e., insulating layers deposited between succeedingly higher metal or conducting layers. Another common species of phosphosilicate glass is borophosphosilicate glass BPSG or borophosphosilicate glass . Soda lime phosphosilicate glasses also form the basis for bioactive glasses e.g. Bioglass , a family of materials which chemically convert to mineralised bone hydroxy carbonate apatite in physiological fluid. See also Wafer electronics Glass science DEFAULTSORT Phosphosilicate Glass Category Glass compositions Category Semiconductor device fabrication Glass material stub ... more details
Unreferenced date November 2009 Borophosphosilicate glass , commonly known as BPSG , is a type of silicate glass that includes additives of both boron and phosphorus . Silicate glasses such as phosphosilicate glass PSG and borophosphosilicate glass are commonly used in Fabrication semiconductor semiconductor device fabrication for intermetal layers, i.e., insulating layers deposited between succeedingly higher metal or conducting layers. BPSG has been implicated in increasing a device s susceptibility to soft error s since the Boron 10 isotope is good at capturing thermal neutron s from cosmic radiation . It then undergoes Nuclear fission fission producing a gamma ray , an alpha particle , and a lithium ion. These products may then dump charge into nearby structures, causing data loss bit flipping, or single event upset . In critical designs, depleted boron consisting almost entirely of Boron 11 is used to avoid this effect as a radiation hardening measure. Boron 11 is a by product of the nuclear power nuclear industry . Glass science DEFAULTSORT Borophosphosilicate Glass Category Semiconductor device fabrication Category Glass compositions Category Boron compounds Glass material stub ... more details
unreferenced date December 2009 The front end of line FEOL is the first portion of Fabrication semiconductor IC fabrication where the individual devices transistor s, capacitor s, resistor s, etc. are patterned in the semiconductor . ref cite book title Handbook of Silicon Wafer Cleaning Technology edition 2nd author Karen A. Reinhardt and Werner Kern publisher William Andrew year 2008 isbn 9780815515548 page 202 url http books.google.com books?id UPaD8JUCKr0C&pg PA202 ref FEOL generally covers everything up to but not including the deposition of metal interconnect layers. FEOL contains all processes of CMOS fabrication needed to form fully isolated CMOS elements Selecting the type of Wafer electronics wafer to be used Chemical mechanical planarization and cleaning of the wafer. Shallow trench isolation STI or LOCOS in early processes, with feature size 0.25 m Well formation Field effect transistor Terminals Gate module formation Field effect transistor Terminals Source and drain module formation References reflist Further reading CMOS Circuit Design, Layout, and Simulation Wiley IEEE, 2010. ISBN 978 0 470 88132 3. http books.google.com books?id kxYhNrOKuJQC&pg PA177&dq FEOL pages 177 178 Chapter 7.2 CMOS Process Integration pages 180 199 7.2.1 Frontend of the line integration See also Back end of line DEFAULTSORT Feol Category Electronics manufacturing Category Semiconductor device fabrication compu hardware stub ... more details
Unreferenced stub auto yes date December 2009 Context date October 2009 Homotopotaxy is a process similar to homoepitaxy except for the fact that the thin film growth is not limited to two dimensional growth. Here the substrate is the thin film material. Category Thin film deposition Category Semiconductor device fabrication Electronics stub ... more details
Nautical Wheelers refers to a ship builder that specifically works on the fabrication of hulls of ships. The technique called wheeling is used to form the metal panels that form the hulls of ships. Nautical Wheelers is the name of a song by Jimmy Buffett originally released on the album A1A album A1A Geffen 1974 Category Ship construction 1970s country song stub ... more details
Implantation may have the following meanings. Implantation human embryo , an event that occurs early in human pregnancy in which the human embryo adheres to the wall of the uterus Ion implantation , insertion of ions, in semiconductor device fabrication Implant medicine , insertion of implants wiktionary inline embryo disambig pl Implantacja ... more details
wiktionarypar fabricator Fabricator may refer to Fabrication disambiguation , several meanings Digital fabricator , a device designed to make almost anything Surface fabricator , a person or device that transforms one surface into another, or constructs a surface Fabricator BWO album Fabricator BWO album disambig ... more details
A hardmask is a material used in semiconductor processing as an etch mask in lieu of polymer or other organic soft resist materials. The idea is that polymers tend to be etched easily by oxygen , fluorine , chlorine or other reactive gases to the extent that a pattern defined using polymeric mask is rapidly degraded during plasma etching . material stub Category Semiconductor device fabrication ... more details
Orphan date December 2007 Common Platform is a collaboration between IBM , GlobalFoundries , and Samsung Electronics developed to implement a common process technology across all three companies semiconductor manufacturing facilities. External links http www.commonplatform.com http www.commonplatform.com tech company stub Category Semiconductor device fabrication it Common Platform ... more details
A mask set is a series of electronic data that define geometry for the photolithography steps of semiconductor fabrication. Each of the physical masks generated from this data is called a photomask . A mask set for a modern process typically contains as many as twenty or more masks, each of which defines a specific photolithographic step in the semiconductor fabrication process. Examples of masks include p well n well active poly p select n select contact metal1, 2, 3... For more information, see photolithography and semiconductor manufacturing . References cite id Saint2002 Saint, Christopher and Judy. 2002 . IC Layout Basics . McGraw Hill. ISBN 0 07 138625 4 cite Category Lithography microfabrication ... more details
Primary sources date September 2010 Orphan date February 2009 BJB Enterprises BJB is a liquid resin formulator and supplier based in Tustin, California . BJB has created and marketed their own formulation of machine cast polyurethanes , unfilled urethanes, epoxy, silicone casting rubbers, polyurethane foam systems, epoxy resin systems, aliphatic water clear urethanes, spray applied polyurethane and pigment and release material systems. Many of BJB s product lines are used in the Hollywood special effects industry as well as stereolithography and rapid prototyping companies. Citation needed date September 2010 See also 3D printing Solid freeform fabrication External links http www.bjbenterprises.com DEFAULTSORT Bjb Enterprises Category Solid freeform fabrication Category Companies based in California ... more details
In semiconductor device fabrication , channel stopper or channel stop is an area in semiconductor devices produced by ion implantation implantation or diffusion of ion s, by growing or patterning the silicon oxide , or other isolation methods in semiconductor material with the primary function to limit the spread of the transistor channel channel area or to prevent the formation of parasitic channel s Inversion layer semiconductors inversion layer s . ref Smart Power ICs , by Bruno Murari, Franco Bertotti, Giovanni A. Vignola, Antonio Andreini, 2002, ISBN 3540432388, http books.google.com books?id RARwgdmuHyQC&pg PA120&dq 22channel stopper 22 PPA47,M1 pp. 47, 47 ref References reflist Category Semiconductor device fabrication ... more details
HARMST is an acronym for H igh A spect R atio M icrostructure T echnology that describes fabrication technologies, used to create high aspect ratio aspect ratio microstructures with heights between tens of micrometers up to a centimeter and aspect ratio aspect ratios greater than 10 1. Examples include the LIGA fabrication process, Advanced Silicon Etch advanced silicon etch , and deep reactive ion etching . See also LIGA Advanced Silicon Etch Deep Reactive Ion Etching Microelectromechanical systems High aspect ratio .28HAR.29 silicon micromachining Micromechanical Systems High Aspect Ratio HAR Micromachining External links http www.mancef.org node 56 The International LIGA interest group Category Materials science Category Microtechnology engineering stub ... more details
Is a procedure that rates testability by relating the number of fabrication defects that can in fact be detected with a test vector set under consideration to the total number of conceivable faults. It is used for refining both the Design For Test test circuitry and the Automatic test pattern generation test patterns iteratively, until a satisfactory fault coverage is obtained. ref citation title Digital Integrated Circuit Design From VLSI Architectures to CMOS Fabrication first Hubert last Kaeslin page 24 publisher Cambridge University Press url http books.google.com books?id gdRStcYgf2oC&pg PA24&dq 22fault grading 22 ref See also Automatic test pattern generation Design for Test References references Category Hardware testing ... more details
Unreferenced date June 2011 Infobox company company name Afco Aluminium Factory logo File PNGlogoColorLarge .png 200px company type Private company foundation 2000 location city Al Rai location country br Kuwait industry Aluminium br Fabricators num employees Afco Aluminium Factory was founded by Mohammed Farooq Azam in 2000 as an Aluminium fabrication factory. It has developed into one of the largest aluminium fabricators in Kuwait . Citation needed date July 2011 It is located in the Al Rai industrial zone, the heart of Kuwait industries. Category Aluminium companies Category Kuwait Category Fabrication metal ... more details
Multi Project Chip MPC or Multi Project Wafer MPW services integrate onto microelectronics wafers a number of different integrated circuit designs from various teams including designs from private firms, students and researchers from universities. Because IC fabrication costs are extremely high, it makes sense to share mask and wafer resources to produce designs in low quantities. Worldwide, several MPW services are available from government supported institutions or from private firms including MOSIS, CMP and Europractice. The first well known MPW service was MOSIS Metal Oxide Silicon Implementation Service , established by DARPA as a technical and human infrastructure for VLSI . MOSIS began in 1981 after Lynn Conway organized the first VLSI System Design Course at M.I.T. in 1978. MOSIS primarily services commercial users now but continues to serve university students and researchers. With MOSIS, designs are submitted for fabrication using either open i. e., non proprietary VLSI Design rule checking layout design rules or vendor proprietary rules. Designs are pooled into common lots and run through the fabrication process at foundries. The completed chips packaged or unpackaged are returned to customers. Many silicon fabrication facilities offer MPW runs or a company can produce its own MPW, e.g. combine several of its own designs to form one wafer completely owned by the company. In the latter case, it may be profitable to use most of the wafer for production chips and a small portion for producing prototypes of next generation chips. References http ai.eecs.umich.edu people conway VLSI MIT78 MIT78.html The M.I.T. 1978 VLSI System Design Course Category Electronic design automation Category Electronic engineering Category Semiconductor device fabrication ru Multi Project Wafer ... more details
Orphan date February 2009 Infobox Company Wikipedia WikiProject Companies template company name Soheil Mosun Limited company type Private company Private foundation Etobicoke, Ontario 1973 location Toronto , Ontario key people Darius F.Mosun , Chairman and CEO , Cyrus B.Mosun , Vice Chair and Partner industry Architectural Fabrication products See http www.soheilmosun.com portfolio homepage http www.mosun.com www.mosun.com Soheil Mosun Limited SML is a Custom Architectural Fabrication Manufacturing and Design Build company headquartered in Toronto, Ontario, Canada. Founded in 1973 by Soheil and Brigitta Mosun, SML was established as a privately owned corporation. SML started as an architectural model building firm and has since progressed to a complete design build company capable of servicing any fabrication or architectural manufacturing project. Notable projects Library of Parliament in Ottawa, Canada bronze windows fabrication and restoration. ref name thestar.com http www.thestar.com printArticle 241134 TheStar.com Business Putting bling into buildings Bot generated title ref Gates to the Shrine of Mohammed in Medina, Kingdom of Saudi Arabia ref name thestar.com Elevator cab interior design and fabrication in 1st Canadian Place, Scotia Plaza, BCE Place and the CN Tower ref name thestar.com The construction of the Baha i Temple in Santiago Chile. ref http www.cbc.ca arts artdesign hariri.html CBC.ca Arts Art & Design Higher Power Bot generated title ref ref http www.ca.bahai.org main.cfm?SID 116&storyid 107 The Baha i Community of Canada La communaute baha ie du Canada Bot generated title ref The construction of the International Jewish War Veterans Memorial in Toronto, Canada ref http www.canadianarchitect.com issues ISarticle.asp?id 181593&story id 190184144621&issue 12012006&PC ref Other projects SML is involved in the manufacturing of many awards for various prestigious institutions such as The Genie Award The Gemini Award The Scotiabank Giller Prize The Adv ... more details
Furnace annealing is a process used in Fabrication semiconductor semiconductor device fabrication which consist of heating multiple semiconductor Wafer electronics wafers in order to affect their electrical properties. Heat treatments are designed for different effects. Wafers can be heated in order to activate dopant s, change film to film or film to wafer substrate interfaces, densify deposited films, change states of grown films, repair damage from Ion implantation implants , move dopants or drive dopants from one film into another or from a film into the wafer substrate. Furnace anneals may be integrated into other furnace processing steps, such as oxidations, or may be processed on their own. Furnace anneals are performed by equipment especially built to heat semiconductor wafers. Furnaces are capable of processing lots of wafers at a time but each process can last between several hours and a day. Increasingly, furnace anneals are being supplanted by Rapid Thermal Anneal RTA or Rapid Thermal Processing RTP . The reason for this is the relatively long thermal cycles of furnaces causes dopants that are being activated, especially boron, to diffuse farther than is intended. RTP or RTA fixes this by having thermal cycles for each wafer that is of the order of minutes rather than hours for furnace anneals. Equipment http www.crystec.com kllprode.htm Koyo Thermo Systems annealing furnaces for semiconductor, solar, display and electronic applications http www.ksec.com Kokusai Vertron, Zestone, and ALDINNA Category Semiconductor device fabrication electronics stub ... more details
TOC right Wiktionary Fab or FAB may refer to Commerce Fab brand , a frozen confectionery Fab, a detergent marketed by Colgate Palmolive Culture F.A.B., a radio acknowledgment used in the Thunderbirds TV series Plot Thunderbirds TV series equivalent to modern 10 4 meaning Fully Acknowledged and Briefed Fab magazine Fab magazine , a Canadian gay magazine Film Advisory Board Flavoured alcoholic beverages, also known as alcopop s Organizations Feminist Approaches to Bioethics For a A rea Brasileira , the Brazilian Air Force Fuerza A rea Boliviana , the Bolivian Air Force Science and technology Fly ash brick , a construction material Fab region, the fragment antigen binding portion of an antibody Fabrication science Fabrication A semiconductor fabrication plant Fast atom bombardment , a mass spectrometry technique in chemistry The French American British classification systems for hematological disease Fugasnaya aviatsionnaya bomba Aviation Demolition Bomb , the term for General purpose bomb Soviet Russian GP bombs Russian general purpose bombs Travel FAB, the IATA airport code for Farnborough Airfield Functional Airspace Block in the European Union Persons with the given name Fab Fabrizio Moretti , drummer in The Strokes Fab Morvan , singer of Milli Vanilli Disambig de FAB eo FAB fr FAB it FAB ja FAB pt FAB ... more details
EN 13445 Unfired Pressure Vessels is a standard that provides rules for the design, fabrication, and inspection of pressure vessel s EN 13445 consists of 7 parts EN 13445 1 Unfired pressure vessels Part 1 General EN 13445 2 Unfired pressure vessels Part 2 Materials EN 13445 3 Unfired pressure vessels Part 3 Design EN 13445 4 Unfired pressure vessels Part 4 Fabrication EN 13445 5 Unfired pressure vessels Part 5 Inspection and testing EN 13445 6 Unfired pressure vessels Part 6 Requirements for the design and fabrication of pressure vessels and pressure parts constructed from spheroidal graphite cast iron EN 13445 8 Unfired pressure vessels Part 8 Additional requirements for pressure vessels of aluminium and aluminium alloys Parts 7 and 9 do exist but they are merely technical reports. It was introduced in 2002 as a replacement for national pressure vessel design and construction codes and standards in the European Union and is harmonized with the Pressure Equipment Directive 97 23 EC or PED . See also Pressure Equipment Directive Category Pressure vessels Category EN standards 13445 engineering stub ... more details
Leaded glass may refer to Lead glass , potassium silicate glass which has been impregnated with a small amount of lead oxide in its fabrication Glass panels made by combining multiple small pieces of glass, which may be stained, textured or beveled, with came s Flint glass , an optical glass that has relatively high refractive index and low Abbe number disambiguation Category Glass compositions ... more details
Unreferenced date December 2009 An integrated device manufacturer IDM is a semiconductor company which designs, manufactures, and sells integrated circuit IC products. As a classification, IDM is often used to differentiate between a company which handles fabrication semiconductor semiconductor manufacturing in house, and a fabless semiconductor company , which outsource s production to a third party. Due to the dynamic nature of the semiconductor industry , the term IDM has become less accurate than when it was coined. Fabless operations The terms fabless fabrication less , foundry model foundry , and IDM are now used to describe the role a company has in a business relationship. For example, Motorola owns and operates fabrication facilities fab where it manufactures many computer chip chip product lines, as a traditional IDM would. Yet it is known to contract with merchant foundries for other products, as would fabless companies. Manufacturers Many electronic manufacturing companies engage in business that would qualify them as an IDM including but not limited to Cypress Semiconductor , Fujitsu , Hitachi, Ltd. Hitachi , IBM , Integrated Device Technology IDT , Intersil , Intel , LSI Corporation , Panasonic Corporation Matsushita , Mitsubishi , Freescale , NEC , Philips , NXP Semiconductors NXP , Samsung , STMicroelectronics , Infineon , Renesas , Sony , National Semiconductor , Texas Instruments , Analog Devices , and Toshiba . Reading http books.google.com books?id cTABIcYYWDgC&pg PA8&dq Integrated device manufacturer Understanding fabless IC technology By Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya 1.4.1 Integrated device manufacturer Page 8 DEFAULTSORT Integrated Device Manufacturer Category Semiconductor device fabrication de Halbleiterhersteller ... more details
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